Board Manufacturer’s part number and description

o Detailed BOM with mfg. part numbers and ref designators for PCB layout
o PCB layout, DXF and / or IDF with reference designators Note: Components
Should be consistently identified using the same designation or acronym
o Power dissipation spread sheet listing all critical or vulnerable components
(Typically >1W or heat flux > 1W/in²)
 Power dissipation calculations for entire board
 On-Board Power supply (if used) calculations and specifications
o Manufacturer’s Specification Sheets for the following:
 all high wattage components
 all temperature sensitive devices
 all components with a height greater than .080”
o All relevant design requirements are defined according to a general SOW
 VME, IEEE, PICMG etc.
 Mil Specs
 Environmental Specs
 NASA Specs
 Others

Additional Information and Materials if Possible:

o Sample board if available
o Spec sheets organized in individual folders by manufacturer
o Relevant CAD models of the PCB

SALES@WAVETHERM.COM

The VPX base standard defined in VITA 46 is a scalable backplane technology designed specifically for high speed, critical embedded systems.

The VITA 46 working group was first launched in 2003. At that time VMEbus systems (first introduced in 1981) were in wide use.

The VPX specification was extended in VITA 48 (VITA REDI, Ruggedized Enhanced Design Implementation) to support the increased operating power of high-density electronic modules by defining the mechanical design requirements to support enhanced cooling methods. VPX REDI also sets standards for the use of ESD covers on both sides of boards. WAVETHERM PROVIDES ENGINEERED PRODUCTS & SERVICES THAT MEET the VPX REDI (VITA 48) standard.

OpenVPX (VITA 65) is a system-level VPX specification designed to address interoperability between VPX boards and backplanes from multiple vendors. It was ratified in 2010.

Additional VITA standards have been ratified to support specific types of connectivity and other issues, and new VITA standards are still being actively worked on by their respective VITA committees. 

For a complete history of these VITA standards see https://www.vita.com/History.

Military Applications:

Air

Land

Sea

SPACE.

Mobile commercial
Transport Industry
Machine Industrial control
Outdoor Telecom
Edge and Customer Premise
Equipment
Medical
Enterprise and Data
Digital Imaging

Vibration Class V1
1 hour per axis:
5 Hz to 100 Hz PSD = 0.04 g2/Hz

Vibration Class V2
1 hour per axis:
5 Hz to 100 Hz PSD increasing at 3 dB/octave
100 Hz to 1000 Hz PSD = 0.04 g2/Hz
1000 Hz to 2000 Hz PSD decreasing at 6 dB/octave

Vibration Class V3
1 hour per axis:
5 Hz to 100 Hz PSD increasing at 3 dB/octave
100 Hz to 1000 Hz PSD = 0.1 g2/Hz
1000 Hz to 2000 Hz PSD decreasing at 6 dB/octave

Module operating
temperature:

Air-Cooled -

Min/Max
Inlet Air
Class Temperature
AC1,FC1 0°C 55°C
AC2,FC2 -40°C 55°C
AC3,FC3 -40°C 70°C
AC4,FC4 -55°C 85°C

Conduction-Cooled -

Class Min/Max
CC1 0°C 55°C
CC2 -40°C 55°C
CC3 -40°C 70°C

CC4 -40°C 85°C

Liquid-Cooled -

Inlet Outlet
Class Min/Max
LC1 0°C 50°C
LC2 -40°C 50°C
LC3 -40°C 60°C
LC4 -40°C 70°C

3U Module Dimensions:
3.94ʺ x 6.30” or 5HP

6U Module Dimensions:
9.187ʺ x 6.30” or 5HP

ASSEMBLY ORIENTATION OPTIONS & ATTRIBUTES SUMMARY

PRIMARY SIDE WEDGELOCK ORIENTATION

SECONDARY SIDE WEDGELOCK ORIENTATION

SECONDARY SIDE PASS THRU WEDGELOCK ORIENTATION

BERGQUIST

FUJIPOLY

LAIRD

MCMASTER-CARR

SOUTHCO

Thermal advantages (Shorter more efficient thermal path) 

Mechanical advantages (Reduced tolerance stack-up in coldwall which can impact backplane alignment and module interface with the coldwall)                             

Why design primary side wedge lock heat frames?                    Legacy chassis or PCB layout       

Components that primarily transfer heat to the PCB and not thru the LID of the device, for example power components

YES. THE CENTER HOLE IN THE PCB REFERENCE DESIGNS CAN BE MOVED OR REMOVED WITHOUT HARMING THE VIABILITY OF FIELDING A RUGGEDIZED MODULE.

FULL BOM EXCEPT FOR PCB AND ELECTRONICS.

MACHINED HEATFRAME COMPONENTS, THERMAL INTERFACE MATERIALS CUT TO SIZE, WEDGELOCKS, INJECTOR-EJECTORS, AND MOUNTING HARDWARE.

GENERAL INFO & FAQ'S:

Spreadsheet of hot components showing thermal gradients                             

Analysis of thermally compromised components and / or high wattage components 

Benefits of a thermal analysis 

Need to provide an example of a thermal analysis

YES - BUT WE TYPICALLY RECOMMEND CUSTOMERS' PURSUE OTHER, MORE COST-EFFECTIVE, SOLUTIONS.

ALUMINUM:

AL6061-T6

AL7075-T6

AL6101-T6

COPPER:

STAINLESS STEEL SS300

RDK – Rugged Development Kit – WaveTherm develops products which are called RDK’s or Rugged Development Kits. WaveTherm’s RDK’s
comprise of mechanical parts and knowledge based instructions for how a computer manufacturer can develop products intended for use in harsh environments.

tr𝜇COTS™ – WaveTherm offers a product line for MicroTCA applications which is called truCOTS. These products target off the shelf AMC modules for
ruggedization.

OpenCOTS™ – WaveTherm offers a product line for VPX, openVPX, VME, and cPCI applications which is called OpenCOTS. These products target
manufacturers of single-board computer manufacturers who may desire a standard products-based approach to rugged sbc product development.

CCA or Circuit Card Assembly is a mechanical assembly used to compliment an electronic assembly in a conduction-cooled application.

Conduction-cooling – The transfer of heat by molecular motion from a source of high temperature to a region of lower temperature, tending toward a
result of equalized temperatures.

Rugged Air-Cooled – An electronic assembly secured to withstand various shock and vibration levels which is thermally cooled by forced-air or natural convection.

Hybrid Cooling – An electronic assembly which is cooled simultaneously by conduction-cooling and forced-air or natural convection methods.

Thermal Analysis – WaveTherm has modeled, simulated, and tested many of its products contained in this website. We also offer simulation services
to customers which design their own products or variations of our base products. Simulations can be accomplished for board-level single-board computers, and/or system-level enclosures/chassis. Simulations we support are FEA – Finite Element Analysis and CFD – Computational Fluid Dynamics Analysis.