Board Manufacturer’s part number and description

o Detailed BOM with mfg. part numbers and ref designators for PCB layout
o PCB layout, DXF and / or IDF with reference designators Note: Components
Should be consistently identified using the same designation or acronym
o Power dissipation spread sheet listing all critical or vulnerable components
(Typically >1W or heat flux > 1W/in²)
 Power dissipation calculations for entire board
 On-Board Power supply (if used) calculations and specifications
o Manufacturer’s Specification Sheets for the following:
 all high wattage components
 all temperature sensitive devices
 all components with a height greater than .080”
o All relevant design requirements are defined according to a general SOW
 VME, IEEE, PICMG etc.
 Mil Specs
 Environmental Specs
 NASA Specs
 Others

Additional Information and Materials if Possible:

o Sample board if available
o Spec sheets organized in individual folders by manufacturer
o Relevant CAD models of the PCB

LINK HERE TO FTP OR CLOUD FOR NEW PROJECT.

OR SUBMIT TO SALES@WAVETHERM.COM

MicroTCA.2 and .3 are enhancements to the AdvancedMC.0 standard. MicroTCA system architecture specifies that AMC modules be plugged directly into its backplane, without a carrier card.

The architecture embodied in the MicroTCA specification allows for a high density, high-performance
communications system driven by hot-swappable, conduction-cooled AMC modules.
MTCA. Extreme environments where MicroTCA.2 products are deployed require rugged modules and a hardened enclosure.

The Hardened Convention-
Cooled MicroTCA.2 Specification defines a rugged, air-cooled and conduction-cooled system architecture for COTS military and industrial applications. The hybrid cooling configuration defined in this specification augments the primary forced air cooling method with conduction cooling
by utilizing air flow-through wedgelocks.

Under the MicroTCA.2 Specification, the clam-shells on the AMC modules provide a thermal path from high energy components on the circuit board to

MicroTCA is a modular & open standard, created & maintained by PICMG(PCI Industrial Computer Manufacturers Group).

MICROTCA provides the electrical, mechanical, thermal and management specifications to create Advanced Mezzanine Modules(AMC) that communicate across a switch-fabric backplane.

MicroTCA.2 is a system-level, mission-critical architecture/specification from PICMG which offers guidelines for development of COTS AMC computing modules, and their host environment.

AMC modules are used across several market segments/applications, effecting a natural cost reduction due to being manufactured in higher volume, and are ideally suited for today’s modern mission-critical applications in terms of performance and budget.

WaveTherm’s truCOTS products are intended to reduce NRE costs associated with development
of rugged AMC module mechanical assemblies, while improving board and system performance through superior design.

Military/Aerospace Applications 

Signal processing

RADAR / SONAR systems

SIG-INT/COMINT/ELINT systems

C4ISR/electronic warfare systems

High Energy Physics 

Particle accelerators & colliders 

Medical, Industrial & Communications 

Mobile edge computing (MEC)Network packet analyzers

Oil & gas exploration

Geomatics

Production Control

Digital image/video processing

Enterprise/industrial data processing

Transportation

PICMIG MICROTCA APPLICATION GUIDE

Hybrid Cooled MicroTCA.2
Overview

Basic air-cooled characteristics
Basic conduction-cooling characteristics
Hybrid SolidWedge or other air-flow
through wedgelocks required
Shock and vibration hardened
Extended temperature
Level 2 Maintenance

Hardened MicroTCA.3
Overview

Basic conduction characteristics
Wedgelocks required
Shock and vibration hardened
Extended temperature
Level 2 Maintenance

MicroTCA.2 & MicroTCA.3 single-wide module
dimensions:
Clamshell width: 98 +/- 0.13 mm
Length: 212.70 mm minimum, 225.00 maximum
including front handles.

MicroTCA.2 & MicroTCA.3 double-wide module
dimensions:
Clamshell width: 173+/-0.13 mm
Length: 212.70 mm minimum, 225.00 maximum
including front handles.

MicroTCA.2
Module operating temperature

MicroTCA.2-MIL-FC1 -5°C - +55°C
MicroTCA.2-MIL-FC2 -40°C - +55°C
MicroTCA.2-MIL-FC3 -40°C - +70°C
MicroTCA.2-MIL-FC4 -40°C - +85°C

MicroTCA.2

Module operating temperature

+110°C +3°/-0°C
+85°C + 3°/-0°C
-55°C + 0°C/-3°C
Power Spectral Density: 0.1 g² / Hz
G ‘RMS’ : 11.95
Frequency : 50 - 2000Hz
Duration : 1.0 Hr/axis
(3 axis total)
500 Hours
Relative Humidity : 70%+/-2%
Cl² : 10+/- 3ppb
NO² :200+/- 50ppb
H²S : 10+/- 5ppb
SO² : 100+/- 20ppb
Exposure : 10 days

MicroTCA.2 Module operating temperature

+110°C +3°/-0°C
+85°C + 3°/-0°C
-55°C + 0°C/-3°C
Power Spectral Density: 0.1 g² / Hz
G ‘RMS’ : 11.95
Frequency : 50 - 2000Hz
Duration : 1.0 Hr/axis
(3 axis total)
500 Hours
Relative Humidity : 70%+/-2%
Cl² : 10+/- 3ppb
NO² :200+/- 50ppb
H²S : 10+/- 5ppb
SO² : 100+/- 20ppb
Exposure : 10 days

MicroTCA.3
Module operating temperature

MTCA.3-TEL-1 -5°C - +55°C
MTCA.3-TEL-2 -40°C - +85°C
MTCA.3-MIL-CC2 -40°C - +55°C
MTCA.3-MIL-CC3 -40°C - +70°C
MTCA.3-MIL-CC4 -40°C - +85°C

RDK – Rugged Development Kit – WaveTherm develops products which are called RDK’s or Rugged Development Kits. WaveTherm’s RDK’s comprise of mechanical parts and knowledge based instructions for how a computer manufacturer can develop products intended for use in harsh environments.

truCOTS™ – WaveTherm offers a product line for MicroTCA applications which is called truCOTS. These products target off the shelf AMC modules for
ruggedization.

OpenCOTS™ – WaveTherm offers a product line for VPX, openVPX, VME, and cPCI applications which is called OpenCOTS. These products target
manufacturers of single-board computer manufacturers who may desire a standard products-based approach to rugged sbc product development.

CCA – Conduction-cooled assembly – A mechanical assembly used to compliment an electronic assembly in a conduction-cooled application.

Conduction-cooling – The transfer of heat by molecular motion from a source of high temperature to a region of lower temperature, tending toward a
result of equalized temperatures.

Rugged Air-Cooled – An electronic assembly secured to withstand various shock and vibration levels which is thermally cooled by forced-air or
natural convection.

Hybrid Cooled – An electronic assembly which is cooled simultaneously by conduction-cooling and forced-air or natural convection methods.

Hybrid Cooling is the simultaneous conduction and convection-cooling of the module and is uniquely optimized by the Hybrid SolidWedge as air can be blown through a wedgelock with no long drive screw to obstruct air flow.

HYBRID COOLING ILLUSTRATION

Hybrid VPX combines the greater cooling capacity of convection cooling with the ruggedness and thermal transfer of conduction cooling. WaveTherm's Hybrid VPX design approach utilizes the module’s finned surface area for cooling which, when combined with the conductive cooling contribution, provides a greatly increased cooling effect.

Existing, standard‐sized 3U and 6U VPX boards are enclosed in an internally sky‐lined clamshell for any required component‐to‐metalwork interface, and feature cross‐flow cooling fins on both the upper and lower covers. Designers can select from wedgelocks that either maximize air flow(3 Segment Hybrid SolidWedge), or maximize the conduction characteristics of the module and/or system(5 Segment Hybrid SolidWedge).

The inherent thermal conduction path that is created between modules once they are installed with their respective wedgelocks engaged, facilitates thermal load sharing between PCB module assemblies so that a high‐powered module can take advantage of the finned air cooling area of adjacent lower‐powered modules, and thus operate as if it has considerable, additional surface cooling area than it possesses independently. Heat pipes can be integrated into enclosure/chassis cold walls to hasten the thermal transfer between modules as well, and can be extended above and/or below the card cage to take advantage of additional heat sinking areas such as finned heat sinks or external cooling surfaces or thermal paths such as a cold plate.

Modules can be environmentally sealed in their cooling fin area with gaskets sealing at both the rear of the module and at the front faceplate. This would allow “dirty air” to be used for cooling of the module while isolating both the backplane and front wiring cavities from external contaminants.

BERGQUIST XXX

T-FLEX 640, 610, 6XX, 6XX

Thermal Analysis –

WaveTherm has modeled, simulated, and tested many of its products contained in this website. We also offer simulation services
to customers which design their own products or variations of our base products. Simulations can be accomplished for board-level single-board computers, and/or system-level enclosures/chassis.

Simulations we support are FEA – Finite Element Analysis and CFD – Computational Fluid Dynamics Analysis

WHAT WE NEED TO BEGIN A THERMAL ANALYSIS FOR YOUR PROJECT:

Spreadsheet of hot components showing thermal gradients                             

Analysis of thermally compromised components and / or high wattage components 

Benefits of a thermal analysis 

FEA OF 6U PCB

YES - BUT WE TYPICALLY RECOMMEND CUSTOMERS' PURSUE OTHER, MORE COST-EFFECTIVE, SOLUTIONS.

STRUCTURAL SIMULATION ON SOLIDWEDGE MOUNTING BLOCK

ALUMINUM:

AL6061-T6

AL7075-T6

AL6101-T6

COPPER:

STAINLESS STEEL SS300

WAVETHERM PRODUCT COMPATIBILITY SELECTOR