Clicky

WaveTherm Corporation

truCOTS AMC Rugged Design Kits

Qty:

The AMC Development kit provides the
architecture and components to facilitate rapid
development of a MicroTCA.3 module. Our
clearly defined process for migration to
conduction cooled modules provides building
blocks which are reusable across multiple
product development cycles.

Features:

  • Complies to current mTCA.3
  • Open Shell Design
  • Fits Most AMC Modules
  • Customizable Heat Plate

Standard Sizes:

  • Half Height Module
  • Mid Height Module
  • Full Height Module
  • Power Module

Kit Includes:

  • Upper Clamshell
  • Lower Clamshell
  • SolidWedge PCB Retainers/wedgelocks/card locks
  • Thermal Interface Material
  • Assembly Hardware
  • 3D Models Available

Materials: Aluminum 6061-T6

  • Upper Clamshell
  • Lower Clamshell
  • SolidWedge PCB Retainers/wedgelocks/card locks

                300 Series Stainless Steel

  • All Fasteners