WaveTherm Corporation

3U VPX Compliant Hybrid-Cooled Thermal Load Board Module



WT ASSY # - 43224-00

The WaveTherm 3U VPX Hybrid-Cooled Thermal Load-Board Module is a cost-effective solution for thermal testing of rugged or Mil-Spec enclosures and systems using wedge locks and air-flow cooling methods concurrently.  

The WaveTherm OpenCOTS Load Board PCB enables several variants of the Hybrid SolidWedge wedgelock which maximizes conduction-cooling characteristics while simultaneously offering maximum, unobstructed air-flow over the finned, conduction-cooled module.

The SolidWedge's distinctive feature of lacking a long center drive screw or long center rail used for traditional wedgelock segment alignment, facilitates a design which produces equal force distribution of the module in the cold wall slot(front to rear), maximizes contact surface area, while offering the unimpeded air-flow through the wedgelocks and across the finned, conduction-cooled module.

International standards organizations have initiated and produced publicly available test data that definitively suggests that this cooling method results in a 15%-30% increase in thermal capacity, while exceeding common military-spec shake and vibration requirements.


  • Complies to VPX Backplane Standards
  • Customizable Heat Plates 
  • 115W Dissipated at 5, 12, 24, 48 volts
  • Primary or Secondary-Side Wedgelocks
  • Two Type T Thermocouples located in heatframe with leads accessible to user


  • IEEE 1101.2
  • VITA 48.2

Kit Includes:

  • Host Heat Frame
  • PCB Load Board
  • Pair of Hybrid SolidWedge Card Retainers
  • Field Replaceable Injection / Ejection Handles
  • Thermal Interface Materials
  • Assembly Hardware
  • 3D Models Available

Aluminum 6061-T6
- All Heat Frames
- All Covers
- Hybrid SolidWedge

Other Materials Available:
Aluminum 6101-T6