3U VPX & CPCI Thermal Simulation

FEA
CFD
Conduction-cooling Thermal Resistance Network

3U VPX & CPCI Thermal Simulation

Regular price $1,750.00
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Thermal Analysis - 

WaveTherm Corporation shall use the heatframe assembly solid models created for your PCB and perform a steady-state thermal analysis of the new design.

Definition of Thermal Analysis - 

Using a thermal analysis software package, WaveTherm Corporation will perform a steady-state heat transfer analysis to predict component temperatures for your design in its intended environment. The analysis phase will assume worst-case thermal scenarios to predict component temperatures. 

Conduction Cooled Design Environment - 

Conduction Heat transfer only, natural convection and radiation will be ignored during the analysis

Operating Temperature: 0C Cold Wall to determine the steady state temperature rise of each critical component

Board thermal interface material and finish shall be chosen to maximize thermal transfers. 

Deliverables - 

  • Purchase of "Quantity 1" is for one thermal simulation set-up, and one simulation at your desired environmental parameters. 
  • The results of the thermal analysis will be presented in spreadsheet format, and delivered via email.

DUNS # 96-236-6667 

CAGE CODE:  6THJ1 

NAICS CODE# 332510

SIC 3499 

SAM UNIQUE ID: FNJKWMCCCH18

NAICS CODES: 332510, 332999

ITAR CERTIFICATION 

WAVETHERM QUALITY MANUAL

SolidWedge™

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ENHANCE THE PERFORMANCE & RELIABILITY OF YOUR SYSTEM WITH ONE DESIGN DECISION.

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