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WaveTherm Corporation

3U VPX & CPCI Thermal Simulation



Thermal Analysis -

WaveTherm Corporation shall use the heatframe assembly solid models created for your PCB and perform a steady-state thermal analysis of the new design.

 

Definition of Thermal Analysis -

Using a thermal analysis software package, WaveTherm Corporation will perform a steady-state heat transfer analysis to predict component temperatures for your design in its intended environment. The analysis phase will assume worst-case thermal scenarios to predict component temperatures. 

 

Conduction Cooled Design Environment -


Conduction Heat transfer only, natural convection and radiation will be ignored during the analysis
Operating Temperature: 0C Cold Wall to determine the steady state temperature rise of each critical component
Board thermal interface material and finish shall be chosen to maximize thermal transfers.

 

Deliverables - 

  • Purchase of "Quantity 1" is for one thermal simulation set-up, and one simulation at your desired environmental parameters. 
  • The results of the thermal analysis will be presented in spreadsheet format, and delivered via email.
VPX KNOWLEDGE BASE
VPX is a specification defining a rugged conduction-cooled system architecture for COTS military and industrial applications.

Extreme environments where VPX products are deployed require rugged modules and a hardened enclosure. The VITA 48.2 Specification defines a rugged, conduction-cooled system architecture for COTS military and industrial applications.

Under the VITA 48.2 / VPX Specification, the Conduction-cooled heatframe assembly (CCA) on the modules provide a thermal path from high energy components on the circuit board to the outer metal frame of the module. SolidWedge wedgelocks mounted on the heatframe serve to secure the module into the chassis cold-wall in order to withstand the necessary shock and vibration conditions. Force provided by the wedgelocks ensure firm contact between the module edges and the chassis slots in order to transfer thermal energy from the module to the enclosure in this conduction-cooled configuration.
Overview Vibration Class V1
  • Basic air-cooled characteristics
  • Basic conduction-cooling characteristics
  • Wedgelocks
  • Shock and vibration hardened
  • Extended temperature
  • Level 2 Maintenance
1 hour per axis:
5 Hz to 100 Hz PSD = 0.04 g2/Hz
Vibration Class V2
1 hour per axis:
5 Hz to 100 Hz PSD increasing at 3 dB/octave
100 Hz to 1000 Hz PSD 0.04 g2/Hz
1000 Hz to 2000 Hz PSD decreasing at 6 dB/octave
3U Module Dimensions Vibration Class V3
3.94" x 6.30" 4HP or 5HP 1 hour per axis:
5 Hz to 100 Hz PSD increasing at 3 dB/octave
100 Hz to 1000 Hz PSD 0.1 g2/Hz
1000 Hz to 2000 Hz PSD decreasing at 6 dB/octave
Applications Served - Module Operating Temperature
  • Military Applications: Air, Land, and Sea
  • Mobile commercial or Transport Industry
  • Machine Industrial control
  • Outdoor Telecom = Edge and Customer Premise Equipment
  • Medical
  • Enterprise and Data
  • Digital Imaging
Conduction-Cooled
Class Min/Max
CC1: 0°C / 55°C
CC2: -40°C / 55°C
CC3: -40°C / 70°C
CC4: -40°C / 85°C
Conduction-Cooled Liquid-Cooled
Class Min/Max
CC1: 0°C / 55°C
CC2: -40°C / 55°C
CC3: -40°C / 70°C
CC4: -40°C / 85°C
Inlet Outlet
Class Min/Max
LC1: 0°C / 50°C
LC2: -40°C / 55°C
LC3: -40°C / 60°C
LC4: -40°C / 70°C
MICROTCA KNOWLEDGE BASE
Hybrid-Cooled MicroTCA.2 MicroTCA.2
Overview Module operating temperature:
  • Basic air-cooled characteristics
  • Basic conduction-cooling characteristics
  • Hybrid SolidWedge or other air-flow through wedgelocks required
  • Shock and vibration hardened
  • Extended temperature
  • Level 2 Maintenance
MicroTCA.2-MIL-FC1 -5°C - +55°C
MicroTCA.2-MIL-FC2 -40°C - +55°C
MicroTCA.2-MIL-FC3 -40°C - +70°C
MicroTCA.2-MIL-FC4 -40°C - +85°C
Hardened MicroTCA.3 MicroTCA.3
Overview Module operating temperature:
  • Basic conduction characteristics
  • Wedgelocks required
  • Shock and vibration hardened
  • Extended temperature
  • Level 2 Maintenance
MTCA.3-TEL-1 -5°C - +55°C
MTCA.3-TEL-2 -40°C - +85°C
MTCA.3-MIL-CC2 -40°C - +55°C
MTCA.3-MIL-CC3 -40°C - +70°C
MTCA.3-MIL-CC4 -40°C - +85°C
Specifications MicroTCA.2 & MicroTCA.3
Single-wide module dimensions: Shock:
  • Clamshell width: 98 +/- 0.13 mm
  • Length: 212.70 mm minimum, 225.00 maximum including front handles
MIL-STD-810, Method 516:
40g, 11 millisecond shock either half-sine or sawtooth pulses in all three axes.
Double-wide module dimensions: Vibration:
  • Clamshell width: 173 +/- 0.13 mm
  • Length: 212.70 mm minimum, 225.00 maximum including front handles
MIL-STD-810, Method 514:

Random vibration for 1 hour per axis: 5 Hz to 100 Hz Power Spectral Density increasingat 3 dB/octave 100 Hz to 1000 Hz PSD = 0.1 g2/Hz 1000 Hz to 2000 Hz PSD decreasing at 6 dB/octave

Test results prove no electrical discontinuity of the gold finger contacts during any of these tests.
Aplications Served - Environmentla Testing:
  • Military: Air, Land, and Sea
  • Mobile commercial or Transport Industry
  • Machine Industrial control
  • outdoor Telecom - Edge and Customer Premise Equipment
  • Medical
  • Enterprise and Data
  • Digital Imaging
Using 50 microinch plated Goldfinger Contacts as specified In mTCA.2 and mTCA.3, a 10 day test using Mixed Flowing Gas (MFG) proved no plating degradation.