{"id":388318752,"title":"3U VPX Hybrid-Cooled Thermal Load Board Module","handle":"3u-vpx-hybrid-cooled-thermal-load-board-module","description":"\u003cp\u003eOC-HC-VPX-3U-5HP-SS-225-LB48\u003c\/p\u003e\n\u003cp\u003eWT ASSY # - 43096-00\u003c\/p\u003e\n\u003cp\u003eThe WaveTherm 3U VPX Hybrid-Cooled Thermal Load-Board Module is a cost-effective solution for thermal testing of rugged or Mil-Spec enclosures and systems using wedge locks and air-flow cooling methods concurrently.  \u003c\/p\u003e\n\u003cp\u003eThe WaveTherm OpenCOTS Load Board PCB enables several variants of the Hybrid SolidWedge wedgelock which maximizes conduction-cooling characteristics while simultaneously offering maximum, unobstructed air-flow over the finned, conduction-cooled module.\u003c\/p\u003e\n\u003cp\u003eThe SolidWedge's distinctive feature of lacking a long center drive screw or long center rail used for traditional wedgelock segment alignment, facilitates a design which produces equal force distribution of the module in the cold wall slot(front to rear), maximizes contact surface area, while offering the unimpeded air-flow through the wedgelocks and across the finned, conduction-cooled module.\u003c\/p\u003e\n\u003cp\u003eInternational standards organizations have initiated and produced publicly available test data that definitively suggests that this cooling method results in a 15%-30% increase in thermal capacity, while exceeding common military-spec shake and vibration requirements.\u003c\/p\u003e\n\u003cp\u003eFeatures:\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003e\u003cspan style=\"line-height: 1.2;\"\u003eComplies to VPX Backplane Standards\u003c\/span\u003e\u003c\/li\u003e\n\u003cli\u003eCustomizable Heat Plates \u003c\/li\u003e\n\u003cli\u003e115W Dissipated at 5, 12, 24, 48 volts\u003c\/li\u003e\n\u003cli\u003ePrimary or Secondary-Side Wedgelocks\u003c\/li\u003e\n\u003cli\u003eTwo Type T Thermocouples located in heatframe with leads accessible to user\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp\u003eSpecs:\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003e\u003cspan style=\"line-height: 1.2;\"\u003eIEEE 1101.2\u003c\/span\u003e\u003c\/li\u003e\n\u003cli\u003eVITA 48.2\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp\u003eKit Includes:\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003e\u003cspan style=\"line-height: 1.2;\"\u003eHost Heat Frame\u003c\/span\u003e\u003c\/li\u003e\n\u003cli\u003ePCB Load Board\u003c\/li\u003e\n\u003cli\u003ePair of Hybrid SolidWedge Card Retainers\u003c\/li\u003e\n\u003cli\u003eField Replaceable Injection \/ Ejection Handles\u003c\/li\u003e\n\u003cli\u003eThermal Interface Materials\u003c\/li\u003e\n\u003cli\u003eAssembly Hardware\u003c\/li\u003e\n\u003cli\u003e3D Models Available\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp\u003eMaterials:\u003cbr\u003eAluminum 6061-T6\u003cbr\u003e - All Heat Frames\u003cbr\u003e - All Covers\u003cbr\u003e - Hybrid SolidWedge\u003cbr\u003e\u003cbr\u003eOther Materials Available:\u003cbr\u003eCopper\u003cbr\u003eAluminum 6101-T6\u003c\/p\u003e\n\u003cp\u003e\u003ca style=\"color: #93c47d;\" href=\"https:\/\/pipedrivewebforms.com\/form\/0365f115683e74632f0b422cd2aab3313124760\"\u003eHigh Quantity Request for Quote\u003c\/a\u003e\u003c\/p\u003e","published_at":"2014-11-30T14:45:00-05:00","created_at":"2014-11-30T14:45:58-05:00","vendor":"WaveTherm Corporation","type":"Chassis","tags":["Form Factor_3U","Type_Loadboard","Type_Thermal Testing"],"price":159500,"price_min":159500,"price_max":199500,"available":true,"price_varies":true,"compare_at_price":null,"compare_at_price_min":0,"compare_at_price_max":0,"compare_at_price_varies":false,"variants":[{"id":1038295632,"title":"WT ASSY# 43096-00","option1":"WT ASSY# 43096-00","option2":null,"option3":null,"sku":"43096-00","requires_shipping":true,"taxable":false,"featured_image":null,"available":true,"name":"3U VPX Hybrid-Cooled Thermal Load Board Module - 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43096-00\u003c\/p\u003e\n\u003cp\u003eThe WaveTherm 3U VPX Hybrid-Cooled Thermal Load-Board Module is a cost-effective solution for thermal testing of rugged or Mil-Spec enclosures and systems using wedge locks and air-flow cooling methods concurrently.  \u003c\/p\u003e\n\u003cp\u003eThe WaveTherm OpenCOTS Load Board PCB enables several variants of the Hybrid SolidWedge wedgelock which maximizes conduction-cooling characteristics while simultaneously offering maximum, unobstructed air-flow over the finned, conduction-cooled module.\u003c\/p\u003e\n\u003cp\u003eThe SolidWedge's distinctive feature of lacking a long center drive screw or long center rail used for traditional wedgelock segment alignment, facilitates a design which produces equal force distribution of the module in the cold wall slot(front to rear), maximizes contact surface area, while offering the unimpeded air-flow through the wedgelocks and across the finned, conduction-cooled module.\u003c\/p\u003e\n\u003cp\u003eInternational standards organizations have initiated and produced publicly available test data that definitively suggests that this cooling method results in a 15%-30% increase in thermal capacity, while exceeding common military-spec shake and vibration requirements.\u003c\/p\u003e\n\u003cp\u003eFeatures:\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003e\u003cspan style=\"line-height: 1.2;\"\u003eComplies to VPX Backplane Standards\u003c\/span\u003e\u003c\/li\u003e\n\u003cli\u003eCustomizable Heat Plates \u003c\/li\u003e\n\u003cli\u003e115W Dissipated at 5, 12, 24, 48 volts\u003c\/li\u003e\n\u003cli\u003ePrimary or Secondary-Side Wedgelocks\u003c\/li\u003e\n\u003cli\u003eTwo Type T Thermocouples located in heatframe with leads accessible to user\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp\u003eSpecs:\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003e\u003cspan style=\"line-height: 1.2;\"\u003eIEEE 1101.2\u003c\/span\u003e\u003c\/li\u003e\n\u003cli\u003eVITA 48.2\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp\u003eKit Includes:\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003e\u003cspan style=\"line-height: 1.2;\"\u003eHost Heat Frame\u003c\/span\u003e\u003c\/li\u003e\n\u003cli\u003ePCB Load Board\u003c\/li\u003e\n\u003cli\u003ePair of Hybrid SolidWedge Card Retainers\u003c\/li\u003e\n\u003cli\u003eField Replaceable Injection \/ Ejection Handles\u003c\/li\u003e\n\u003cli\u003eThermal Interface Materials\u003c\/li\u003e\n\u003cli\u003eAssembly Hardware\u003c\/li\u003e\n\u003cli\u003e3D Models Available\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp\u003eMaterials:\u003cbr\u003eAluminum 6061-T6\u003cbr\u003e - All Heat Frames\u003cbr\u003e - All Covers\u003cbr\u003e - Hybrid SolidWedge\u003cbr\u003e\u003cbr\u003eOther Materials Available:\u003cbr\u003eCopper\u003cbr\u003eAluminum 6101-T6\u003c\/p\u003e\n\u003cp\u003e\u003ca style=\"color: #93c47d;\" href=\"https:\/\/pipedrivewebforms.com\/form\/0365f115683e74632f0b422cd2aab3313124760\"\u003eHigh Quantity Request for Quote\u003c\/a\u003e\u003c\/p\u003e"}

3U VPX Hybrid-Cooled Thermal Load Board Module

Product Description

OC-HC-VPX-3U-5HP-SS-225-LB48

WT ASSY # - 43096-00

The WaveTherm 3U VPX Hybrid-Cooled Thermal Load-Board Module is a cost-effective solution for thermal testing of rugged or Mil-Spec enclosures and systems using wedge locks and air-flow cooling methods concurrently.  

The WaveTherm OpenCOTS Load Board PCB enables several variants of the Hybrid SolidWedge wedgelock which maximizes conduction-cooling characteristics while simultaneously offering maximum, unobstructed air-flow over the finned, conduction-cooled module.

The SolidWedge's distinctive feature of lacking a long center drive screw or long center rail used for traditional wedgelock segment alignment, facilitates a design which produces equal force distribution of the module in the cold wall slot(front to rear), maximizes contact surface area, while offering the unimpeded air-flow through the wedgelocks and across the finned, conduction-cooled module.

International standards organizations have initiated and produced publicly available test data that definitively suggests that this cooling method results in a 15%-30% increase in thermal capacity, while exceeding common military-spec shake and vibration requirements.

Features:

  • Complies to VPX Backplane Standards
  • Customizable Heat Plates 
  • 115W Dissipated at 5, 12, 24, 48 volts
  • Primary or Secondary-Side Wedgelocks
  • Two Type T Thermocouples located in heatframe with leads accessible to user

Specs:

  • IEEE 1101.2
  • VITA 48.2

Kit Includes:

  • Host Heat Frame
  • PCB Load Board
  • Pair of Hybrid SolidWedge Card Retainers
  • Field Replaceable Injection / Ejection Handles
  • Thermal Interface Materials
  • Assembly Hardware
  • 3D Models Available

Materials:
Aluminum 6061-T6
- All Heat Frames
- All Covers
- Hybrid SolidWedge

Other Materials Available:
Copper
Aluminum 6101-T6

High Quantity Request for Quote

$1,995.00
Maximum quantity available reached.